Compact Laser Marking Machine

Compact Laser Marking Machine

Precision and Portability in Laser Marking

Compact Laser marking machines utilize laser beams to engrave various patterns on glass surfaces, including 3C logos, corporate logos, QR codes and more.
This eliminates the hassle of manual ink printing. Furthermore, laser-engraved QR codes create conditions for glass manufacturers to realize automated and unmanned production.

Models:
DS-JJD Series
Laser Power:
10W/15W

Technical Specifications

Compact Laser Marking Machine Model Size
ModelsLaser PowerFeatures
DS-JJD-10 (Standalone version)10W UV
DS-JJD-10-CN (QR Connect version)10W UVScan paper barcode to read glass information. Marking content customizable as client’s requirements(3C mark / LOGO / QR code).
DS-JJD-15 (Standalone version)15W UV
DS-JJD-15-CN (QR Connect version)15W UVScan paper barcode to read glass information. Marking content customizable as client’s requirements (3C mark / LOGO / QR code).

FAQs about the Compact Laser Marking Machine

Key Technical Features

FEATURE 1

Integrated & modular design, compact, flexible, 4th-gen high-speed laser printing system.

FEATURE 2

Ultraviolet cold laser for ultra-fine processing, no damage to workpiece surface.

FEATURE 3

Permanent & clear marking, pollution-free, better than inkjet coding.

FEATURE 4

Wide compatibility: glass, PCB, plastic, wafer, metal coating and more.

Why Choose Our Compact Laser Marking Machine?

This high-speed laser coding system represents our company's fourth generation of such technology. Featuring an integrated, modular design and standardized manufacturing, it combines compactness, high flexibility, high speed, and user-friendly operation, significantly enhancing overall performance.

Utilizing a unique low-power laser beam, the UV laser marking machine is ideally suited for high-end, ultra-precision processing applications.It delivers fine, clear, and durable markings—superior to ink-based coding and pollution-free—on surfaces such as packaging bottles for cosmetics, pharmaceuticals, food, and polymer materials. Its capabilities also extend to marking and dicing flexible PCBs; micro-via and blind-via processing on silicon wafers; QR code marking on LCD glass;drilling glass products; marking metal coatings; and processing plastic keypads, electronic components, gifts, communication equipment, and construction materials.

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